Motherboard Disassemble Platform Heating Groove For iPhone X/XS/XS Max - T12A - X3 - OEM NEW

Description

The motherboard disassembles platform heating groove for iPhone X/XS/XS Max - T12A - X3 is suitable for iPhone X/XS/XS Mas motherboard

repair heating disassembly, CPU and other components heating degumming. It is matched with the Motherboard Disassemble Platform Main Unit - SS-T12A.

Note

This item is just including the iPhone X/XS/XS Max - T12A - X3 motherboard heating groove, not including the heating station's main unit.

Specifications

● Model: T12A - X3

● Motherboard heating groove size: 126*72*18mm (L*W*H)

● Temperature: 100-280℃

Compatibility

For iPhone X/XS/XS Max

Features

● The motherboard disassembles platform heating groove including the heating area for iPhone X/XS/XS Max, CPU glue removal area.

● The motherboard disassembles platform heating groove for iPhone X/XS/XS Max is only heating the middle column, without heating the CPU.

● Silicone insulation, high-temperature resistance, lowering the temperature of the bottom contact surface.

● High-purify copper is used as the contact surface to ensure uniform heat transfer and heat.

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Packing

Original package + carton box

After-sale service

Please feel free to contact us for any problems at any time: service@poerl.com

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