Motherboard Disassemble Platform Heating Groove For Mobile Phone - T12A - F

Description

The motherboard disassemble platform heating groove for mobile phone - T12A - F including heating area, Fingerprint repair

heating slot, IC slot, Universal heating slot, Silicone insulation, High purity copper film, Screen bracket in addition to glue. It is used to bracket

heating degumming, IC heating degumming, Universal heating and removing glue, Fingerprint repair, and glue removal. It is matched with

the Motherboard Disassemble Platform Main Unit - SS-T12A.

Note

This item is just including the mobile phone - T12A - F motherboard heating groove, not including the heating station's main unit.

Specifications

● Model: T12A - F

● motherboard heating groove size: 126*72*18 mm (L*W*H)

● Net weight: 363 g

● Temperature: 100-280℃

Compatibility

For Mobile Phone

Features

● Accurate temperature control and temperature adjustable.

● Offers heat evenly to protect the motherboard from damage.

● High purity copper is used as a film to ensure uniform heat transfer and heat.

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Packing

Original package + carton box

After-sale service

Please feel free to contact us for any problems at any time：service@poerl.com

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