Motherboard Disassemble Platform Heating Groove For Mobile Phone - T12A - CPU

Description

The motherboard disassemble platform heating groove for mobile phone - T12A - CPU including heating area, Silicone insulation, High purity copper film.

It is matched with the Motherboard Disassemble Platform Main Unit - SS-T12A.

Note

This item is just including the mobile phone - T12A - CPU motherboard heating groove, not including the heating station's main unit.

Specifications

● Model: T12A - CPU

● motherboard heating groove size: 126*72*18 mm (L*W*H)

● Net weight: 289 g

● Temperature: 100-280℃

Compatibility

For Mobile Phone

Features

● Accurate temperature control and temperature adjustable.

● Offers heat evenly to protect the motherboard from damage.

● High purity copper is used as a film to ensure uniform heat transfer and heat.

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Packing

Original package + carton box

After-sale service

Please feel free to contact us for any problems at any time：service@poerl.com

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