Motherboard Disassemble Platform Main Unit For Mobile Phone - SS -T12A - OEM NEW

Description

The motherboard disassemble platform main unit for mobile phone - SS-T12A is a double layers board pre-heating rework station, it is used for quick

desolder&resolder for mobile phone double-layer logic board. It is matched with the Motherboard Disassemble Platform Heating Groove.

Note

This item is just including the mobile phone - SS - T12A heating station main unit, not including the motherboard heating groove.

Specifications

● Model: SS-T12A

● Main machine size: 124*90*40mm (L*W*H)

● Input: AC110-230V, 50/60Hz, 5A

● Net weight: 375 g

● Rated Power: 70W

● Temperature: 100-280℃

Compatibility

For mobile phone

Features

● Accurate temperature control and temperature adjustable

● Offers heat evenly to protect the motherboard from damage

● Adopting 185 degrees layered process to remove the mobile phone's motherboard.

solder paste, but it depends on the special heating design and precise temperature control of SS-T12A.

● SS-T12A motherboard separate platform only heats the area that the mobile phone's board needs to be removed to prevent improper heating.

● Dual bayonet design, make sure the mobile phone's motherboard is stable on the stage.

● High purity copper is used as a film to ensure uniform heat transfer and heat.

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Packing

Original package + carton box

After-sale service

Please feel free to contact us for any problems at any time：service@poerl.com

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