BGA Reball Steel Stencil for Samsung Galaxy S8 Plus

Specifications

● Material: steel

● Thickness: 0.12 mm

● Color: Sliver

Features

● Adopt steel material, can be heated directly by the hot air gun

● Easy and quickly for reballing the BGA IC

● Replacement for IC or BGA rework reballing

● Convenient usage for professionals

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Packing

Zip-lock bag + carton box

After Sales Service

Please feel free to contact us for any problem at any time: service@poerl.com